Static Burn-In System
Overview of Equipment
This burn-in system subjects semiconductor devices and assembled electronic devices to various thermal and electrical stress, and it is effective for removing semiconductor devices with surface contamination and input circuit deterioration.
Please scroll horizontally to look at table below.
| Model | Target specimen | Temperature range |
|---|---|---|
| RBS | IC, discrete, other general semiconductor devices, various electronic parts, electronic units, and substrates | H:+70 to +150°C M:+20 to +150°C L:-30 to +150°C U:-55 to +150°C |
Outside dimensions (mm)
Please scroll horizontally to look at table below.
| Model | W | H | D |
|---|---|---|---|
| 00 type | 780 | 2050 | 1250 |
| 0 type | 780 | 2050 | 1530 |
| 1 type | 1060 | 2050 | 1250 |
| 2 type | 1060 | 2050 | 1530 |
| 3 type | 1060 | 2050 | 1250 |
| 4 type | 1060 | 2050 | 1530 |
| 7 type | 1360 | 2050 | 1250 |
| 8 type | 1360 | 2050 | 1530 |
| 9 type | 1680 | 2050 | 1250 |
| 10 type | 1680 | 2050 | 1530 |
| 12 type | 2300 | 2050 | 1250 |
| 12 type | 2300 | 2050 | 1530 |
Recommended products for customers viewing this product
- Contact us
- Customer Support Desk
Measurement & Evaluation Systems / Semiconductor-related Equipment
-
Measurement & Evaluation Systems
- Electro-chemical Migration Evaluation System
- High Voltage Bias Insulation Resistance Evaluation System
- PID（Potential Induced Degradation）Evaluation System
- Capacitor Leakage Test System
- High Temperature Reverse Bias Test System
- TDDB (Time-Dependent Dielectric Breakdown) Evaluation System
- Conductor Resistance Evaluation System (AMR)
- Electromigration Evaluation System (AEM-2000)
- PV Thermal-Bias Combo Test System
- Semiconductor Parametric Test System
- Capasitor / Inductor Temperature Characteristic Evaluation System
- PV I-V Evaluation System (PV Thermal-Light Combo Test System)
- Power Cycle Test System
- Semiconductor-related Equipment
