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Static Burn-In System

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Overview of Equipment

This burn-in system subjects semiconductor devices and assembled electronic devices to various thermal and electrical stress, and it is effective for removing semiconductor devices with surface contamination and input circuit deterioration.

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Model Target specimen Temperature range
RBS IC, discrete, other general semiconductor devices, various electronic parts, electronic units, and substrates H:+70 to +150°C
M:+20 to +150°C
L:-30 to +150°C
U:-55 to +150°C
Outside dimensions (mm)

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Model W H D
00 type 780 2050 1250
0 type 780 2050 1530
1 type 1060 2050 1250
2 type 1060 2050 1530
3 type 1060 2050 1250
4 type 1060 2050 1530
7 type 1360 2050 1250
8 type 1360 2050 1530
9 type 1680 2050 1250
10 type 1680 2050 1530
12 type 2300 2050 1250
12 type 2300 2050 1530

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