This system evaluates the reliability of high-density semiconductor devices and performs large capacity screenings. Featuring excellent temperature uniformity performance and permissible heat generation load characteristics, this system accommodates a large capacity of burn-in boards (increased by 33%) and saves space with a compact design. It uses an HFC refrigerant with a zero ozone layer depletion coefficient and a damper open/close control system for ventilation control, and an electronic expansion valve provides control of the refrigerant flow rate for significant energy savings. In addition, all molded parts are quality marked and can be recycled as a resource.
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Model Target specimen Temperature range RBC-H IC, discrete, other general semiconductor devices, various electronic parts, electronic units, and substrates +70 to +150°C RBC-M +20 to +150°C RBC-L -30 to +150°C RBC-U -55 to +150°C
- Outside dimensions (mm)
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Model W H D 00 type 780 2050 1250 0 type 780 2050 1530 1 type 1060 2050 1250 2 type 1060 2050 1530 3 type 1060 2050 1250 4 type 1060 2050 1530 7 type 1360 2050 1250 8 type 1360 2050 1530 9 type 1680 2050 1250 10 type 1680 2050 1530 11 type 2300 2050 1250 12 type 2300 2050 1530
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