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Burn-In Chamber

  • ozone

Overview of Equipment

This system evaluates the reliability of semiconductor devices and performs large capacity screenings. With a burn-in board inserted, it has excellent temperature uniformity performance and allowable heat generation load characteristics. It uses an HFC refrigerant with a zero ozone layer depletion coefficient and a damper open/close control system for ventilation control. An electronic expansion valve provides control of the refrigerant flow rate for significant energy savings. In addition, metal molded parts are quality marked and can be recycled as a resource.

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Model Target specimen Temperature range
RBC-H IC, discrete, other general semiconductor devices, various electronic parts, electronic units, and substrates +70 to +150°C
RBC-M +20 to +150°C
RBC-L -30 to +150°C
RBC-U -55 to +150°C
Outside dimensions (mm)

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Model W H D
0 type 780 2050 1530
2 type 1060 2050 1530
4 type 1060 2050 1530
8 type 1360 2050 1530
10 type 1680 2050 1530
12 type 2300 2050 1530

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