Electromigration Evaluation System

Overview of Equipment

LSI wiring (Cu/next-generation material) life degradation test under high temperatures

As the miniaturization and advancement of semiconductor devices progresses, wiring line widths have reached the nanometer scale, making electromigration evaluation increasingly important for predicting product life and establishing design rules.
This evaluation equipment applies temperature stress, which is a lifespan acceleration factor, and highly accurate current stress to a large number of evaluation samples, and monitors resistance changes and time to breakdown.
It is also equipped with analysis software that helps to determine the necessary parameters for judging the life of a device.
This can contribute to improving the quality of next-generation semiconductors, from material development to process optimization and reliability assurance.

Main specifications

Please scroll horizontally to look at table below.

Stress current source	Output range	±(0.01 to 50mA) ±(0.1 to 200mA) ±(0.1 to 500mA)
Stress current source	Compliance voltage	+33 to -21V
Extrusion test voltage	Output range	-20 to +20V
Extrusion test voltage	Accuracy	± (2% of set point ＋ 20mV)
Oven	Temperature control range	(Ambient temperature +70°C) to +350°C
Oven	Temperature uniformity	±3.5°C (at +350°C)

System variation

Please scroll horizontally to look at table below.

No. of evaluated channels		300ch specification	200ch specification	100ch specification
EM module Output current^*	Oven 1	50mA/200mA/ 500mA	50mA/200mA/ 500mA	50mA/200mA/ 500mA
	Oven 2	50mA/200mA/ 500mA	50mA/200mA/ 500mA	-
	Oven 3	50mA/200mA/ 500mA	-	-
DUT board	Number of installed units	30 (10 × 3 ovens)	20 (10 × 2 ovens)	10
DUT board	IC socket	10 each per board (DIP 28-pin, 600mil and 300mil)

* Select one of three types of EM modules

Monitor Screen

The monitor screen offers real-time information on the test progress, resistance, and rate of change of all DUTs at a glance.The test condition settings screen allows you to enter and review all items on a single screen.

: Monitor screen

Analytical Software

The system is equipped with analysis software that automatically calculates the parameters necessary for judging the life of a device from reliability tests.
Both primary data and secondary data are automatically updated in real time as graphs, allowing you to visually grasp life trends even during testing.