In July 2026, ESPEC CORP. (Head Office: Kita-ku, Osaka; President and Representative Director: Satoshi Arata) launched the AMR-SPM Low-Current Conductor Reliability Evaluation System, which detects minute resistance fluctuations at low currents. The system supports reliability evaluation of interconnects, including microvias, and interposer connections, in advanced package development.

With the advancement of generative AI and the proliferation of high-performance devices, demand for higher-speed, higher-density semiconductor packages is rapidly increasing. In advanced packages designed to meet these demands, micro-bump interconnections and wiring structures are becoming finer and more complex as chiplet integration and 2.5D/3D integration are adopted and redistribution layers become finer-pitched and multilayered. Advanced packages require minute resistance changes occurring in micro-bump interconnections and other components to be detected with high accuracy while minimizing stress on the fine wiring leading to the joints.

The AMR-SPM Low-Current Conductor Reliability Evaluation System is a newly developed conductor resistance evaluation system that enables the application of low currents while maintaining high measurement accuracy. By applying minute currents that do not place an excessive load on specimens and detecting minute changes in resistance values with high accuracy, the system can evaluate the effects of bonding materials and process conditions on interconnection reliability. Specializing in measurement currents of 10 mA or less, the system achieves low-resistance measurement at the 1 mΩ level by applying a minute current of 1 mA.
ESPEC has also launched the AMI-SPM Low-Voltage Insulation Reliability Evaluation System, which detects insulation degradation in the low-voltage range with greater accuracy.

ESPEC will continue expanding its products and services for the AI semiconductor market, where technological innovation is advancing, to help improve reliability and solve technical challenges.

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  Low-Current Conductor Reliability Evaluation System
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Features of the AMR-SPM Low-Current Conductor Reliability Evaluation System

1. Conductor resistance evaluation system enabling the application of low currents while maintaining high measurement accuracy
   Advanced packages require minute resistance changes occurring in micro-bump interconnections and other components to be detected with high accuracy while minimizing stress on the fine wiring leading to the joints. The AMR-SPM is a newly developed conductor resistance evaluation system that enables the application of low currents while maintaining high measurement accuracy. Specializing in measurement currents of 10 mA or less, the system achieves low-resistance measurement at the 1 mΩ level by applying a minute current of 1 mA.
   
2. Selectable measurement modes to suit the evaluation purpose
   The AMR-SPM allows switching between a "High-Accuracy Mode," which detects minute resistance changes with high accuracy, and a "High-Speed Mode," which captures initial failure behavior, helping optimize test conditions according to the evaluation purpose.
3. Improved usability with a benchtop design
   For the AMR-SPM, the system rack has been redesigned with a benchtop configuration, reducing the footprint by approximately 60% and the weight by approximately 80%. This makes it easier to install at development sites. Measurement channels can also be flexibly expanded from 40 to 280 channels depending on the samples being evaluated and the number of measurement points.
4. Newly developed software enabling Weibull analysis during testing
   The system comes standard with statistical processing software that incorporates measurement data in real time during testing and enables Weibull analysis and other statistical analyses. Previously, measurement data had to be retrieved after testing and processed separately for statistical analysis. This software enables prompt analysis while checking data trends during testing. By reducing the analysis workload after testing and supporting earlier assessment of evaluation results, the software helps shorten development cycles.
   Real-time data updates during testing

Specifications

*Preliminary specifications. Specifications are subject to change without notice.