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Ensuring Reliability of AI Semiconductors and Autonomous Driving
ESPEC Expands Highly Accelerated Stress Test System Lineup with Deeper Model with Larger Test Capacity Capable of Large Boards to Support Fast-paced Product Development
Nov 6, 2025
ESPEC CORP. (Head Office: Kita-ku, Osaka City; Representative Director and President: Satoshi Arata) introduced a new model EHS-222M-L to its Highly Accelerated Stress Test System (HAST CHAMBER) lineup in October 2025 that supports testing of large PCBs such as multilayer PCB/motherboard. This new model enables the testing of large volumes of specimens at once, helping to shorten development cycles of electronics components and boost reliability.

Highly Accelerated Stress
Test System
(HAST CHAMBER)
EHS-222M-L
The Highly Accelerated Stress Test System puts specimens under three types of stress simultaneously (high temperature, high humidity, and pressure) to test the life of electronic components as well as the reliability of failure modes, etc. over an abbreviated testing schedule. Electronic components used for generative AI, data centers, autonomous driving services, and other cutting-edge technologies have seen advances in miniaturization and higher performance in recent years. ESPEC offers highly effective solutions to meet increasing demand for accelerating Time-to-Market. In addition, ensuring high reliability requires statistically significant data, meaning that large volumes of data are required. This led to higher demand for testing of large board or accommodating testing of large number of specimens simultaneously. ESPEC launched a new Highly Accelerated Stress Test System deeper version model EHS-222M-L to meet these needs (200 mm long in the depth). This model also doubles the number of specimen signal terminals applying voltage and signal to specimens for bias testing to increase test capacity at one time. In addition, the customer can flexibly adjust the number of terminals and customize the jigs for allowing power-up of specimens as needed. ESPEC draws on its rich expertise to offer optimal testing environments to contribute to ensuring the reliability of electronic components.
The Highly Accelerated Stress Test System puts specimens under three types of stress simultaneously (high temperature, high humidity, and pressure) to test the life of electronic components as well as the reliability of failure modes, etc. over an abbreviated testing schedule. Electronic components used for generative AI, data centers, autonomous driving services, and other cutting-edge technologies have seen advances in miniaturization and higher performance in recent years. ESPEC offers highly effective solutions to meet increasing demand for accelerating Time-to-Market. In addition, ensuring high reliability requires statistically significant data, meaning that large volumes of data are required. This led to higher demand for testing of large board or accommodating testing of large number of specimens simultaneously. ESPEC launched a new Highly Accelerated Stress Test System deeper version model EHS-222M-L to meet these needs (200 mm long in the depth). This model also doubles the number of specimen signal terminals applying voltage and signal to specimens for bias testing to increase test capacity at one time. In addition, the customer can flexibly adjust the number of terminals and customize the jigs for allowing power-up of specimens as needed. ESPEC draws on its rich expertise to offer optimal testing environments to contribute to ensuring the reliability of electronic components.

Highly Accelerated Stress Test System
(HAST CHAMBER)
EHS-222M-L
ESPEC remains committed to expanding its lineup of products that resolve issues in AI, autonomous driving services, and other advanced technologies.
■ Highly Accelerated Stress Test System (HAST) deeper model EHS-222M-L
<Features>
- Deeper version model with 120 pins specimen signal terminals to maximize testing efficiency
Internal dimensions is 394 mm × 626 mm, expanding the depth by 200 mm compared to existing standard models with internal dimensions of 394 mm × 426 mm. This enables testing of larger board (e.g., 290 mm × 460 mm, 220 mm × 470 mm) and multiple jigs. This model also features more terminals used to apply voltage and signals to specimens, increasing to 1,000 V/120 pins from the existing standard models' 1,000 V/36 pins (up to 60 pins), increasing test efficiency and saving testing time to accelerate Time-to-Market. - The number of terminals and jigs can be customized for optimal testing environment
The customer can flexibly customize the jigs and the number of terminals used to fit their needs. ESPEC draws on its track record and rich expertise in jig production, including component selection and structural design, to offer optimal testing environments. - Increasing work efficiency by connector blocks
The use of connector blocks eliminates the need for soldering, terminal number checking, and other time-consuming tasks and simplifies wiring work.
<Main Specifications>
| Temperature range | +105.0 to +142.9℃ |
|---|---|
| Humidity range | 75 to 100% rh |
| Pressure range | 0.019 to 0.193 MPa (Gauge) |
| Internal dimensions (mm) External dimensions (mm) |
φ394 × D626 W1000 × H1713 × D1200 |
Product page
Contact Details
Sustainability Management Department, ESPEC CORP.
E-mail:ir-div@espec.jp



