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Ensuring Semiconductor Reliability

Lineup of rapid change rate test chambers with low GWP refrigerant R-449A achieving a change rate of 20K/min for JEDEC/IPC standards

Apr 11, 2025

ESPEC CORP. (Head Office: Kita-ku, Osaka City; Representative Director and President: Satoshi Arata) will be introducing a new high-performance model to its Rapid-Rate Thermal Cycle Chamber lineup in April 2025. This new model offers specimen temperature ramp control at a rate of 20K/min and meets industry and international standards for semiconductor reliability testing.

As high-performance semiconductors used in generative AI, data centers, autonomous driving services, and other fields continue to become more highly integrated and higher density, resulting in higher heat generation environments, the need for high-reliability testing under extreme conditions during the development process has increased. One key performance evaluation is thermal cycling, which involves rapid temperature changes at a constant rate. In recent years, a stricter temperature change rate of 20K/min has become a requirement in international standards.
The new high-performance rapid-rate thermal cycle chamber supports test temperatures from -70°C to +180°C and enables specimen temperature ramp control at both 15K/min and 20K/min, allowing for compliance with various international testing standards including JEDEC*1 and IEC*2. It also uses the low global warming potential (GWP*3) refrigerant R-449A, supporting compliance with Japan's Fluorocarbon Emissions Control Act (Act on Rational Use and Proper Management of Fluorocarbons)*4. This chamber helps ensure the reliability of advanced semiconductors and in-vehicle electronics exposed to rapid temperature changes.

As a top manufacturer of environmental test chambers, ESPEC remains committed to supporting innovation in AI, autonomous driving services, and other advanced technologies by delivering environmentally friendly products and solutions.

  • TCC-151W-20 Rapid-Rate Thermal Cycle Chamber
    TCC-151W-20
    Rapid-Rate Thermal Cycle Chamber

■ TCC-151W-20 Rapid-Rate Thermal Cycle Chamber

<Features>
<Main Specifications>
Temperature range -70°C to +180°C
Temperature change rate 20K/min *With 5 kg specimen (glass epoxy board) + 4 kg jig
Test area capacity 160 L
Internal dimensions (mm)/External dimensions (mm) W800 × H500 × D400/W1000 × H1808 × D1913

Contact Details:

For Products:
Customer Support Desk
Customer Support Desk| Inquiries | ESPEC CORP.

For news release:
Sustainability Management Department
Email: ir-div@espec.jp

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