News
Ensuring Semiconductor Reliability
Lineup of rapid change rate test chambers with low GWP refrigerant R-449A achieving a change rate of 20K/min for JEDEC/IPC standards
Apr 11, 2025
ESPEC CORP. (Head Office: Kita-ku, Osaka City; Representative Director and President: Satoshi Arata) will be introducing a new high-performance model to its Rapid-Rate Thermal Cycle Chamber lineup in April 2025. This new model offers specimen temperature ramp control at a rate of 20K/min and meets industry and international standards for semiconductor reliability testing.
As high-performance semiconductors used in generative AI, data centers, autonomous driving services, and other fields continue to become more highly integrated and higher density, resulting in higher heat generation environments, the need for high-reliability testing under extreme conditions during the development process has increased. One key performance evaluation is thermal cycling, which involves rapid temperature changes at a constant rate. In recent years, a stricter temperature change rate of 20K/min has become a requirement in international standards.
The new high-performance rapid-rate thermal cycle chamber supports test temperatures from -70°C to +180°C and enables specimen temperature ramp control at both 15K/min and 20K/min, allowing for compliance with various international testing standards including JEDEC*1 and IEC*2. It also uses the low global warming potential (GWP*3) refrigerant R-449A, supporting compliance with Japan's Fluorocarbon Emissions Control Act (Act on Rational Use and Proper Management of Fluorocarbons)*4. This chamber helps ensure the reliability of advanced semiconductors and in-vehicle electronics exposed to rapid temperature changes.
As a top manufacturer of environmental test chambers, ESPEC remains committed to supporting innovation in AI, autonomous driving services, and other advanced technologies by delivering environmentally friendly products and solutions.
TCC-151W-20
Rapid-Rate Thermal Cycle Chamber
■ TCC-151W-20 Rapid-Rate Thermal Cycle Chamber
<Features>
- Linear 20K/min
More accurate lifetime evaluations through specimen temperature ramp control. - Compliance with JEDEC and IPC standards
Meets the 15K/min thermal cycle test requirements for the JESD22-A104 semiconductor package reliability test standard and the 15?20K/min evaluation conditions in the IPC-9701 de facto mounting board evaluation testing standard. - Compliant with updated IEC 60068-2-14 standard requirements
Meets the revised IEC 60068-2-14 Nb (constant rate temperature change test) international standard for electronics and automotive markets, including the new stricter requirement for a temperature change rate of 20K/min or faster, as well as the latest IEC standard requirements. - Adopts R-449A low-GWP refrigerant
Uses R-449A low-GWP refrigerant (GWP: 1397) instead of R-404A high temperature-side refrigerant (GWP: 3920) for the cascade cooling system, reducing the global warming potential by 64%.
<Main Specifications>
Temperature range | -70°C to +180°C |
---|---|
Temperature change rate | 20K/min *With 5 kg specimen (glass epoxy board) + 4 kg jig |
Test area capacity | 160 L |
Internal dimensions (mm)/External dimensions (mm) | W800 × H500 × D400/W1000 × H1808 × D1913 |
- *1 JESD22-A104
Established by the Joint Electron Devices Engineering Council (JEDEC), an organization that sets standards for the semiconductor industry, this standard is used for reliability testing and thermal cycle testing of semiconductor devices.
The standard requires a temperature change rate of 15K/min or less (recommended range: 10-14K/min). - *2 IEC 60068-2-14 Nb
This international standard for environmental testing of electrotechnical products issued by the International Electrotechnical Commission (IEC) specifies requirements for constant rate temperature change testing of electronic equipment and components as well as in-vehicle electrical and electronic equipment.
The standard requires temperature change rates of 1K/min, 3K/min, 5K/min, 10K/min, 15K/min, 20K/min, and 25K/min. - *3 GWP (Global Warming Potential)
This number uses carbon dioxide as a reference to express the degree of global warming effects of other greenhouse gases. A lower value indicates less environmental load. - *4 Act on Rational Use and Proper Management of Fluorocarbons
Portal site: http://www.env.go.jp/earth/furon/index.html
Contact Details:
For Products:
Customer Support Desk
Customer Support Desk| Inquiries | ESPEC CORP.
For news release:
Sustainability Management Department
Email: ir-div@espec.jp