[Reliability Testing] Technology Trends

Complies with testing of leading-edge processes according to reliability standards / Reliable lifespan prediction for microscopic wiring processes / Complies with testing of leading-edge 3D packages according to reliability standards / Reliable lifespan prediction for microscopic packaging technologies

[Reliability Testing] Quality Trends
High allowable heat load, microscopic bonding technologies, and technologies to mount more pins

Reliability of TSV joints / Countermeasures for local heat generation of chips / Board heat dissipation design / Mitigation of thermal expansion impact between stacked materials / Evaluation of multiple types of bonding materials

Joint Reliability Evaluation (Narrated)
Compliance with semiconductor test standards

JEITA ED4701/001A
JEITA ED4701/100A

• Test method 102A: High-temperature, high-humidity bias test

• Test method 103A: High-temperature, high-humidity storage test

• Test method 104A: Humidification + Packaging stress series test

• Test method 105A: Thermal cycle test

JEITA ED4701/200A

• Test method 201A: High-temperature storage test

• Test method 202A: Low-temperature storage test (reference test)

• Test method 203A: Temperature and humidity cycle test (reference test)

Phenomenon of electrochemical migration
(Ion migration)
Microcracks at a joint
Electrochemical Migration Evaluation of Insulation
Temperature and Humidity Test,
Thermal Cycle Test
Highly Accelerated Test, PCT Test
Evaluation of Microcracks in Wire Joints
Thermal Cycle Test, Rapid Temperature Change
Thermal Shock Test
Reliability Evaluation of Microscopic Wiring Connections
HALT, HASS
Thermal Management

Electrochemical Migration Evaluation of Insulation (Ion Migration)

For more accurate, more efficient electrochemical migration evaluation

Electro-Chemical Migration Evaluation System (AMI)

Electrochemical Migration Evaluation of Insulation (Ion Migration)

For more accurate, more efficient electrochemical migration evaluation

Electro-Chemical Migration Evaluation System (AMI)

Temperature and Humidity Test, Thermal Cycle Test

The global standard temperature & humidity chamber in the pursuit of performance, operability, and energy savings

Environmental Stress Chamber (Rapid-Rate Temperature Cycle Type)
Platinous J Series
Temperature and Humidity Test, Thermal Cycle Test
Additional Updates

Highly Accelerated Test, PCT Test

IEC 60068-2-66-compliant
for impressive bias testing support


HAST CHAMBER
Highly Accelerated Test, PCT Test
Additional Updates

Evaluation of microcracks in wire joints

Streamlined reliability evaluations
with accurate identification of weak points in joints

Conductor Resistance Evaluation System (AMR)

Evaluation of microcracks in wire joints

Streamlined reliability evaluations
with accurate identification of weak points in joints

Conductor Resistance Evaluation System (AMR)

Thermal Cycle Test, Rapid Temperature Change

JEDEC-compliant temperature stress evaluations
with advanced temperature control and rapid change capabilities

Rapid-Rate Thermal Cycle Chamber
Thermal Cycle Test, Rapid Temperature Change
Additional Updates

Thermal Shock Test

Varied lineup with high-temperature and large-capacity models
to meet a wide range of testing needs

[Fixed Test Area Type] Thermal Shock Chamber (TSA) 
[Elevator Type] Thermal Shock Chamber (TSD) 
[Elevator Type] Compact Thermal Shock Chamber (TSE) 
Liquid-to-Liquid Thermal Shock Chamber (TSB)
Thermal Shock Chamber
Additional Updates

Reliability Evaluation of Microscopic Wiring Connections

Highly accurate evaluation of accelerated degradation
due to temperature and current stress

Electro-Migration Evaluation System
(AEM Series)

HALT, HASS

Quick identification of latent defects
in early development stages

HALT/HASS Test System

Thermal Management

Chamber-less model with air injection
for specimen heating and cooling

Spot Cooling and Heating System

Uniform wind-free heating ideal for temperature characteristics evaluation and thermal analysis verification of semiconductors and printed circuit boards

Tabletop Temperature and Humidity Chamber
Thermal Dependent Warpage Measurement System / Thermal Image Analysis System / Commissioned Analysis Service