[Back-End Process] Technology Trends
Chiplet and heterogeneous technology

Advanced 2.xD 3D package / Fine redistribution layer (RDL) / Interposer / Optoelectronic integration technology / Chip stacking technology / Low-K materials

[Back-End Process] Quality Trends
Quality evaluations in middle-end and back-end processes

Finer redistribution layers and TSV connection / Effect of local heat generation of chips / Quality of the fine implementation process in middle-end process