Static Burn-In System

ozone

This burn-in system subjects semiconductor devices and assembled electronic devices to various thermal and electrical stress, and it is effective for removing semiconductor devices with surface contamination and input circuit deterioration.

Model Target specimen Temperature range
RBS IC, discrete, other general semiconductor devices, various electronic parts, electronic units, and substrates H:+70 to +150°C
M:+20 to +150°C
L:-30 to +150°C
U:-55 to +150°C
Outside dimensions (mm)
Model W H D
00 type 780 2050 1250
0 type 780 2050 1530
1 type 1060 2050 1250
2 type 1060 2050 1530
3 type 1060 2050 1250
4 type 1060 2050 1530
7 type 1360 2050 1250
8 type 1360 2050 1530
9 type 1680 2050 1250
10 type 1680 2050 1530
12 type 2300 2050 1250
12 type 2300 2050 1530