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ThermalshocktestEvaluationofmicrocracksinwirejointsReliabilityevaluationofmicroscopicwiringconnectionsHALT,HASSThermalmanagement3DPhenomenonofelectrochemicalmigration(Ionmigration)Microcracksatajoint◆CompliancewithsemiconductorteststandardsJEITAED4701/001AJEITAED4701/100ATestmethod102A:High-temperature,high-humiditybiastestTestmethod103A:High-temperature,high-humiditystoragetestTestmethod104A:Humidification+PackagingstressseriestestTestmethod105A:ThermalcycletestJEITAED4701/200ATestmethod201A:High-temperaturestoragetestTestmethod202A:Low-temperaturestoragetest(referencetest)Testmethod203A:Temperatureandhumiditycycletest(referencetest)ThermalshockchamberSemiconductormeasurementsystemsHALT,HASSOne-device,spotheatingandcoolingConductorResistanceEvaluationSystem(AMRSeries)◆TSASeries◆TSDSeries◆TSBSeries◆ConductorResistanceEvaluationSystem(AMRSeries)◆Electro-MigrationEvaluation◆TyphoonSeries◆MTASeriesSystem(AEMSeries)https://www.espec.co.jp/english/products/catalog/tsa.pdfhttps://www.espec.co.jp/english/products/catalog/amr.pdfhttps://www.espec.co.jp/english/products/measure-semicon/aem/https://espec.com/na/products/#halthttps://www.espec.co.jp/products/env-test/mta/(Japaneseonly)TheSpotCoolingandHeatingSystemisachamber-freesystemwherespecimensarecooledandheatedbyairsprayedbyahose.Thefrontheatertypechangesairtemperatureby100°C/min,allowingforsignificantreductionsintestingtime.Thermalshockchambersaredesignedforreliabilitytestingbyacceleratingdeterioration,suchascracksatjoints,byinstantaneouslyswitchingbetweenhighandlowtemperatures.Elevator-typeandtheliquid-to-liquidthermalshocktypechambersarealsoavailable.MIL-STD-883LIEC60068-2-14Na,ED-2531BNa✓Microcrackinjointsandotherconnectiondefectscauseconductionfailuresonlywhenthetemperaturerapidlychanges.Withathermalshockchamber,theConductorResistanceEvaluationSystemcancaptureconductorresistanceinrealtimeinacontrolledtemperatureenvironment,allowingforquickandaccurateevaluationofconnectionreliability.Electromigrationevaluationtestsassessthelifespanofsemiconductorinterconnectsbyapplyingoptimalcurrentdensityandtemperatureforacceleratedtesting.Acceleratedtestingcanalsobeperformedathightemperaturesat450°C.PerformingHALTataninitialstageoftheproductdevelopmentprocesscanimproveproductreliability.ThisseriesalsosupportsHASS.—✓———✓——
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