>> P.6
SemiconductorHeatTreatmentSystemAnaerobicCleanOven(Oxygenconcentrationat10ppm)ApplicableEquipmentAnaerobicCleanOven●Idealforlowoxygenannealingrequiredfor3Dsemiconductorpackagingandintegration.●Enablesheattreatmentatthelowestoxygenconcentrationof10ppm(0.001%)andClass5cleanliness.●Handleslowoxygen,high-temperatureannealingfrom350to500°C.Reducedprocesstimebywatercooling.https://www.espec.co.jp/english/products/env-test/sco/Large-CapacityTypesLargeHighlyAcceleratedStressTestSystem—HASTChamberRapid-RateThermalCycleChamberDimensionsinsidetestareaØ548mm×L560mmhttps://www.espec.co.jp/english/products/env-test/ehs431/Internaldimensions(mm)W800×H500×D750https://www.espec.co.jp/english/products/catalog/tcc301.pdfPowerSemiconductor-RelatedEquipmentHighTemperatureReverseBiasTestSystemHTRBHTGBH3TRBAMIPowerCycleTestSystemApplicableSeriesApplicableSeriesRBS-PSTWhenthevoltageofapowerdeviceisshutdown,theinductorsinthecircuitgeneratesurgevoltage,whichmaydamagethedevice.Reversebiastestisrepeatedlyconductedtoimprovethereliabilityofproducts.DrainpowersupplyGatepowersupply0to2kVor0to3kV0to±30Vor0to±35Vhttps://www.espec.co.jp/english/products/measure-semicon/bias/TemperaturecontrolIn-chamberDUTboardconnectiontype:200°Cor350°C*Temperature/humiditytypeisalsoavailable.https://www.espec.co.jp/english/products/measure-semicon/fet-igbt/Self-heatingcyclesduetocurrenton/offofpowerdevicescausewiringdisconnectionanddestructionofheatdissipationcircuits.Powercycletestsareconductedtoimproveproductreliability.MajortestmodesContinuousmodeControlthetemperatureandvolumeofcoolingwatertoachievethedevicetemperaturesettingwhile“Ice”isconstant.VfcyclemodeRepeatthecontrolof“Ice”ON/OFFforspecimentemperaturetoachievethesettingtemperature.CyclemodeRepeat“Ice”ON/OFFbysettingthetime.https://www.espec.co.jp/english3-5-6,Tenjinbashi,Kita-ku,Osaka530-8550,JapanTel:81-6-6358-4785LEAFNo.20250503Id6B07L006(asofMay2025)
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