>> P.3
Temperatureandhumiditytest,thermalcycletestHighlyacceleratedtest,PCTtestElectrochemicalmigrationevaluationofThermalcycletestmicroscopicpatterninsulation(HBT/HHBT)RapidtemperaturechangeReliabilitytestfield◆Complieswithtestingofleading-edgeprocessesaccordingtothereliabilitystandards◆Reliablelifespanpredictionformicroscopicwiringprocesses◆Complieswithtestingofleading-edge3Dpackagesaccordingtothereliabilitystandards◆ReliablelifespanpredictionformicroscopicpackagingtechnologiesFC-BGA2.xDAllowablehighheatload,microscopicbondingtechnologies,andtechnologiestomountmorepins◆ReliabilityofTSVjoints◆Countermeasuresforlocalheatgenerationofchips◆Boardheatdissipationdesign◆Mitigationofthermalexpansionimpactbetweenstackedmaterials◆EvaluationofmultipletypesofbondingmaterialsChipcrackatjoint.NarrowerbumppitchesSiliconchipSubstrateLargerpackagesizesNeedstomitigatewarpageBondfailuresoccurbetweenmotherboardandsubstrates.Needstodeveloplow-thermalexpansionmaterialsandnewbondingmethodsSiliconchipSubstrateMotherboardTemperatureandhumiditychambersHASTchamberSemiconductormeasurementsystemsRecommendedsystemforreliabilityevaluationtesting:Electro-ChemicalMigrationEvaluationSystem(AMISeries)Rapid-ratethermalcyclechamberRecommendedsystemforreliabilityevaluationtesting:◆PlatinousSeries◆ARSeries◆EHSSeries◆Electro-ChemicalMigrationEvaluationSystem(AMISeries)◆TCCSerieshttps://www.espec.co.jp/english/products/catalog/ar01.pdfOurchamberscanperformtemperatureandhumiditytestingcompliedtosemiconductorreliabilityteststandards.Themostsuitablemodelcanbeselectedfromtheextensiveproductlineupwithvariouscapacitiesandtemperatureandhumidityranges.PlatinousJSeriesTemperature(&Humidity)Chamberhttps://www.espec.co.jp/english/products/catalog/pj.pdfhttps://www.espec.co.jp/english/products/catalog/ehs.pdfhttps://www.espec.co.jp/english/products/catalog/ami.pdfhttps://www.espec.co.jp/english/products/catalog/tcc151.pdfThisseriesofdedicatedPCTandHASTchambersacceleratedeteriorationbypressurizingintothechamberduringsemiconductorreliabilitytesting.Thisinsulationevaluationsystemcaninstantaneouslycapturedefectiveinsulationphenomena,suchaselectrochemicalmigration,inwiringpatternsonRDLsandsubstrates.ThistemperaturechambercanapplyrapidtemperaturechangestospecimenspreciselyincompliancewithJEDECstandardtestingandscreening.Thesystemcanworkwithtemperatureandhumiditychambersandequippedwithmeasurementcircuitsthatallowsforhigh-speed,high-accuracycaptureofinstantaneousinsulationfailuressuchasmigration.Suitableforautomotivesemiconductors,sensors,andelectronicdevices.ED-4701/100A,103AIEC60068-2-1,IEC60068-2-2IEC60068-2-66,ED-4701/100AJESD22-A118B/A110E/A102E,AEC-Q100✓✓—✓JESD22-A104F,IPC-9701IEC60068-2-14Nb,IEC60749-25✓
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