>> P.4
ElectrochemicalMigrationEvaluationCAFMechanismofelectrochemicalmigrationElectrochemicalmigration(ECM)canresultinthegrowthofametaldepositfromcathodetoanode.ItcouldhappenonboththesurfaceandinsideofPWB.Inelectronics,suchgrowthcanleadtoashort-circuitbybridgingtheelectrodes,potentiallyleadingtointermittentorcompletefailureofelectronicdevices.<Boardsurface><Betweenboardlayers>Anode(+)Cathode(-)Anode(+)Cathode(-)(一例)M+DendriteCAFCAFBoundaryofglassfiberandresinOccursasaresultofmoistureabsorptionandvoltage.CAForConductiveAnodicFilamentisametallicfilamentthatgrowsfromtheanodetowardthecathodesub-surfacealongtheepoxy/glassinterface.Itcanalsogrowfromtheanodeononelayertoacathodeonanother.Cathode(-)Anode(+)CAFBoundaryofglassfiberandresin■ElectrochemicalmigrationoccurswhenvoltageOccursasaresultofmoistureabsorptionandvoltage.isappliedtoasampleinatemperatureandhumidityenvironment.■Samplelifetimeevaluationsarepossibleunderawiderangeofenvironmentalconditions.LinkableModelsTemperature&HumidityChamberHighlyAcceleratedStressTestSystemPlatinousJSeriesBench-topTypeTemperature(&Humidity)ChamberHASTChamber絶縁抵抗値計測Metalionsprecipitatefromthecathode.Occursasaresultofmoistureabsorptionandvoltage.電圧印加85℃Dendriteisadendriticorbranchedgrowthof85%conductivemetalfilamentonthesurfaceofPCBundertheinfluenceofaDCvoltagebiasandambienthumidity.Anode(+)AMICathode(-)恒温恒湿器TestsetupwithanenvironmentaltestchamberDendriteM+(Example)Metalionsprecipitatefromthecathode.Occursasaresultofmoistureabsorptionandvoltage.InsulationresistancemeasurementVoltageapplication85℃85%AMITemperature&HumidityChamber3
| < 
| 
> | 
>>
