>> P.3
Espec'smeasuringproductsinthereliabilityevaluationoftheelectronicequipmentmarketTDDBevaluationtestAMM-TDDB-W(waferevaluation)TDDBevaluationtest(waferevaluation)SemiconductorparametrictestAMM-TDDB-WAMM-WSemiconductorparametrictestBurn-intestAMM-CRBCRBSRBMMBISealingmaterial/substrate/insulationmaterial/soldermaterial/multi-layerboardInsulationresistanceevaluationtest(electro-chemicalmigration)ConductorresistanceevaluationtestAMR(jointreliabilitytest)AMIInsulationresistanceevaluationtest(electro-chemicalmigration)AMITDDBevaluationtest(packageevaluation)AMM-TDDB-CAMIBurn-intestElectromigrationevaluationtestReversebiastest(powerdevice)Powercycletest(powerdevice)Conductorresistanceevaluationtest(jointreliabilitytest)RBCRBSRBMMBIAEMHTRBHTGBH3TRBAMIRBS-PSTAMRPCmanufacturer/mobilephonemanufacturer/in-vehiclecomponentmanufacturer/communicationdevicemanufacturerInsulationresistanceevaluationtest(electro-chemicalmigration)ConductorresistanceevaluationtestAMR(electro-chemicalmigration)AMICapacitor/inductor/resistor/sensorConductorresistanceevaluationtest(jointreliabilitytest)LeakagecurrentmeasurementevaluationtestCapacitortemperaturecharacteristicevaluationtestInductorevaluationtestSensorburn-inAMRAMIAMQAEMRBS2
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