Circuit Board Resin Materials/Wire Materials for Circuit Boards

Products for improving efficiency of evaluation such as insulation and dielectric constant of substrate materials

With the future rise of mmWave 5G, low-loss materials will foresee a rapid growth and play an increasingly important role.
ESPEC is here to support our customers to find an ideal material by providing products that improves efficiency in insulation reliability evaluations and dielectric constant measurements.
Products designed for improving efficiency of conduction reliability evaluation of substrate wiring materials

With the future rise of mmWave 5G, low-loss materials will foresee a rapid growth and play an increasingly important role.
ESPEC is here to support our customers to find an ideal material by providing products that improves efficiency in reliability evaluations.
For electronic devices and substrate
JEDEC/IPC standard temperature cycle test chambers

5th generation mobile communication systems (5G) makes faster communications and lower latency.
As a result, it is required to be used not only in conventional smartphones but also in a wide range of fields such as transportation, medical care, and disaster prevention.
On the other hand, further safety and reliability tests are essential because equipment failure threaten person injured and huge economic losses.
For this reason, the demands for reliability tests based on the JEDEC standard and IPC standard is increasing, and we introduce a dedicated chambers that supports the temperature change rate required by the standard.