>> P.2
KeytechnologyforensuringreliabilitySupportsthecurrenttrendtowardhigherstress.Highaccuracyisincreasinglydemandedinthepursuitofreliabilityinthefieldofcarelectronics.“Liquid-to-liquid”typethermalshocktestingisnowattractingattentionforitsabilitytoimposehigherthermalstressonspecimensthan“air-to-air”typetesting,andtodelivertestresultsquickly.ESPEChassuccessfullydevelopedliquid-to-liquidthermalshockchambersthatsatisfythedemandforlowerrunningcostsfrombrineandpowerconsumption.ThesethermalshockchambersalsoconformtoEUvehiclestandardsthatarecompliantwithIECstandards.TSB-222.1LTSB-52TSB-10TSB-30TSB-15TSB-52TSB-15TSB-22TSB-104.5L2.1L10L4.5L15L10L30L15L1
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