>> P.5
●ConnectionboardUtilityConnectionboardThepinassignmentscramblefunctionmakesitpossibletoevaluateESPECDUTboardsevenusingDUTswithdifferentpinlayouts.FourtestmodesTheAEMSeriesiscapableofperformingfourdifferenttestsbymeasuringresistancewhilestressingtemperatureandcurrent:Electromigration,Stressmigration,Temperaturecharacteristic(TCR),andExtrusion.ReliabilityconcernsorCudamasceneCudamasceneoffersthebenefitsoflowresistanceandhighreliability,butawiderangeofphenomenaappearinviastructureslinkingmulti-layerwiringwhensubectedtothermalstress.viaCuviaCuCuviaCuviaCappinglayerIntegrityLow-kSiSubstrateouleHeatingTCRtestingLeakageCurrentElectromigrationStressVoidingDelaminationEtrusiontestingElectromigrationtestingStressmigrationtestingElectromigrationtestingStressmigrationtesting4
| < 
| 
> | 
>>
