Optical Transmission Devices

To Customers Evaluating Optical Transmission Devices (Optical Transceivers, TOSA, and ROSA)

The speed of communications is increasing and delays are being reduced
by expanding the communications network of 5th generation mobile communications systems (5G).
Along with these technological advances, data traffic is growing heavier and the demand for large data centers is increasing.
Due to the expansion of optical communications networks between data centers, the demand for optical transmission devices has dramatically increased while technologies to increase the speeds of optical transceivers continue being developed.
ESPEC provides optimal products for reliability evaluations (Telcordia standards) and temperature dependency evaluations of optical transmission devices for which technological developments and market size continue to expand.

Test Systems

Reliability evaluations (Telcordia GR-468-CORE Issue 2)
Test Systems

Testing for Telcordia GR-468-CORE Issue 2, a reliability standard, is required for optical transmission devices.
ESPEC provides small, space-saving products that can support thermal shock tests in addition to temperature and humidity.

  • Reliability evaluations (Telcordia GR-468-CORE Issue 2) Test Systems

    <Liquid to Liquid Thermal Shock Chamber>

    • Supports Table 4-3 Thermal Shock (Liquid thermal shock 0 to 100 °C).
    • Space saving installation area of approximately 1.4 m2.

    <Compact Thermal Shock Chamber>

    • Supports 6.3.1 Screening (-40 to +85 °C, 20 cycles).
    • Space saving installation area of approximately
      0.7 m2.

    <Bench-Top Type Temperature (& Humidity) Chamber>

    • Supports Table 5-1 Temp. Cycling (-40 to +85 °C, 50 to 1000 cycles).
    • Supports Table 5-1 High Temp (70 or 85 °C, 5000 or 10000 h).
    • Supports Table 5-1 Damp heat (85 °C/85% rh, 5000 h).
    • 3.3.3.2 Cyclic moisture resistance (25 to 65 °C cycling with 90-100% rh, one -10 °C cycle per 5 sub-cycles)
    • Space saving installation area of approximately 0.35 m2.
    • Test time can be shortened with transitions at a temperature rate of change of 5 °C/min.
    • A door notch (option) is available that can help simplify the work to wire specimens.
    Product name Liquid to Liquid Thermal Shock Chamber Compact Thermal Shock Chamber Bench-Top Type Temperature (& Humidity) Chamber
    Model TSB-22 TSE-12A SU-242 SU-242-5
    (Temperature Change Rate
    5 °C / min)
    SH-242 SH-242-5
    (Temperature Change Rate
    5 °C / min)
    Product appearance
    Temperature range High temperature side: +70 to 200 °C
    Low temperature side:
    -65 to 0 °C
    High temperature side: +60 to 200 °C
    Low temperature side:
    -65 to 0 °C
    -40 to +150 °C
    Humidity range - - - - 30 to 95%rh
    Interior dimensions* (mm) W120×H150×D120
    (Specimen basket dimensions)
    W320×H35×D230
    (Specimen basket dimensions)
    W300×H300×D250
    Outside dimensions(mm) W1140×H1785×D1240 W680×H1745×D1050 W440×H625×D696/D786 W440×H690×D696/D786
    Footprint Approximately 1.4 m2 Approximately 0.7 m2 Approximately 0.3 m2

    * Thermal shock chambers: Large chambers are also available in the Air to Air Thermal Shock Chambers TSA Series. (Capacity 40 to 3,300 l)
    Bench-top type temperature (& humidity) chamber: A 60-l type is also available in addition to the chambers listed above. (Interior dimensions 400 mm (W) × 400 mm (H) × 400 mm (D))

Temperature Characteristics Test System

Attenuation due to the length of high frequency electrical signal wires and bending of optical fibers has become a testing issue in the development of technologies to make optical transceivers faster. ESPEC provides a system that uses direct thermal conduction by heating/cooling plate. This allows high frequency signal wires to be as short as possible and eliminates bends in optical fibers.

  • Temperature Characteristics Test System Plate Heating/Cooling System
    • High frequency signal wires can be as short as possible and bends in optical fibers can be eliminated because specimens and measuring instruments are accessed on a flat table.
    Temperature range -40~150 °C
    Temperature uniformity ±1.5 °C(≦85 °C)
    ±2.0 °C(>85 °C)
    Plate size W210×D300mm

    * The above specifications are an example. Contact ESPEC for details.

  • Sliding tray type bench top chambers
    • A sliding tray is integrated with the door which makes it exceptionally easy to set up with measuring equipment and test samples.
    • The interface of the measuring instrument is located on the door, facilitating access to wiring. It means a shorter wiring length and contributes to improved measurement accuracy and signal transmission speed.
    • Best suited for evaluation of every small devices for 5G and IoT.
    Model SU/SH-222 SU/SH-242/242-5/642 SU/SH-662/262
    Temperature range (℃) -20~+150 -40~+150 -60~+150
    Humidity range (%rh) ※SH only 30~95
    Interface type Flat cable port
    BNC connector
    Sample holder
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