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16 (03.10.1)
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Reliability assurance and reliability testing (environmental testing)
- Why defects and failure occur, and the significance of environmental testing - |
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Abstract
I was recently given the opportunity to analyze the root cause of defects and failure related to reliability and quality control. Why do defects and failure occur? Ultimately, if we answer in terms of
reliability and quality control, failure stems from a lack of process capability and a lack of design
margin. In this report, I shall deal with preventing defects and failure, and I shall consider the use of
reliability testing--environmental testing in particular--as a means of reliability assurance.
I would like to see a redefinition of reliability related to defects and failure in the field of reliability
technology, and with research and investigation performed as reliability technology. Rather than
technology-based, this approach is based on reliability and quality control administrative
technology performed during product development and manufacturing. Reliability testing--
environmental testing in particular--is widely employed as a means of reliability assurance, but
such testing does not fully detect all defects and failure. However, by varying environmental stress
and by increasing its severity, we can indirectly exaggerate the intrinsic stress failure mechanisms
and induce failure. This serves as a crucial means of reliability assurance. Because environmental
testing increases the severity of environmental stress to investigate the stability of product
functions, environmental testing is known as reliability testing. |
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16 (03.10.1)
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Failure Analysis Methods
Part 3: Failure analysis using the scanning electron microscope |
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Abstract
The Scanning Electron Microscope (SEM) is a frequently used surface analysis device capable of
very high magnification with the ability to obtain three-dimensional images. The SEM not only
enables the observer to capture micro information about the surface of a specimen, but also offers
capabilities such as qualitative and quantitative analysis and elemental mapping analysis that
serve as preliminary steps to structural analysis of a specimen. This report will make use of various
examples to introduce failure analysis methods that take advantage of SEM capabilities. |
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15 (03.4.1)
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ISO international safety standards: contents and trends |
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Abstract
Upgrading and revising international safety standards is an ongoing process.
This report presents a fresh overview of the international safety standards and
summarizes current trends in revising those standards. This report will focus
on the ISO international safety standards. |
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15 (03.4.1)
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Failure Analysis Methods
Part 2: Non-destructive analysis using soft X-ray apparatuses |
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Abstract
The technique of X-raying specimens has been employed in failure analysis
for many years. This method can be used to examine materials and structural
components to determine their properties and discover defects without
applying external pressure to the specimen. Defects that cannot be determined
by visual inspection can be reliably ascertained without destroying the
specimen. This report will present some examples of analysis with soft X-ray
apparatuses, which are relatively easy to use. |
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14 (02.10.1)
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Failure Analysis Methods
?Part 1: Cross-sectional observation of electronic parts? |
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Abstract
This series of three articles will present representative methods in common use today for the failure analysis following evaluation testing. |
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10 (00.10.1)
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Safety analysis methods and applications at the design stage of new product degelopment - Introducing the FMFEA and S-H Matrix Method - |
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Abstract
Safety analysis requires a thoroughly methodical investigation-more so than even
reliability analysis. Such analysis must include the ability to deal with problems
involving human error. This report will introduce the FMFEA (Failure Mode Factors and
Effects Analysis) and the S-H (Software and Hardware) Matrix Method. These safety
analysis methods serve as one part of the design review process in the design stage of
new product development. Problem areas can only be discovered using analytical
methods, but at the same time the approach must be efficient. This report will also
include a review of the key application points for these methods. |
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9 (00.4.1)
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Non-destructive testing for product and facility safety |
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Abstract
To insure product safety and reliability in the field of manufacturing, nondestructive
testing is often used to eliminate potential defects before shipping and
to analyze defects when accidents have occurred. Professor Hirayama of Osaka
Sangyo University has contributed this article on the relationship between nondestructive
testing and product safety and reliability. |
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9 (00.4.1)
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Environmental testing and non-destructive failure analysis technology |
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Abstract
This report will discuss failure analysis, and the methods of non-destructive failure
analysis in particular, as used to improve quality by analyzing the occurrence of
failures and providing feedback to the departments concerned. The report will also
include some examples of testing and analysis. |
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