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| TECHNOLOGY REPORT NO.26 (Published on May 7, 2008) |
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| Contents |
| Understanding the Technology: Estimation method for temperature uncertainty of temperature chambers (JTM K 08) |
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| TECHNOLOGY REPORT NO.25 (Published on September 15, 2007) |
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| Contents |
| Preface to the 60th anniversary edition |
| Topics : |
Recent developments at Espec |
| Report: |
The effect of ramp rate on temperature cycle fatigue in solder joints |
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| TECHNOLOGY REPORT NO.24 (Published on May 1, 2007) |
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| Contents |
| Report: |
Evaluating the CAF (conductive
anodic filament) resistance of multi-layered PWBs |
| Understanding the Technology: |
New JTM standards for temperature test
chambers - Methods of testing and indicating performance |
| Topic : |
New model: Super Clean Oven SCO-2 |
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| TECHNOLOGY REPORT NO.23 (Published
on January 5, 2007) |
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| Contents |
| Report: |
Measuring Conductivity of Proton
Conductive Membrane in the direction of thickness, part
II: using the 4-probe method in the direction of thickness |
| Topic : |
Introducing ESPEC EUROPE GmbH |
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| TECHNOLOGY REPORT NO.22 (Published
on September 1, 2006) |
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| Contents |
| Understanding the Technology: |
How
to succeed at accelerated testing |
| Topic : |
Introducing the AEM-2000 Electromigration
Evaluation System |
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| TECHNOLOGY REPORT NO.21 (Published on April 3, 2006) |
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| Contents |
| Report 1 : |
Evaluating hot-dipped solder plating with corrosion testing |
| Topic 1 : |
New Product: Thermal Shock Chamber TSD-100 |
| Topic 2: |
New product: Rapid-rate Thermal Cycle Chamber TCC-150W |
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| TECHNOLOGY REPORT NO.20 (Published on October 3, 2005) |
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| Contents |
| Report 1 : |
Evaluating the reliability of
optical connectors |
| Report 2 : |
Measuring conductivity of proton conductive membranes in the direction of thickness |
| Topic 1 : |
New product focus: Ultra View Temperature (& Humidity) Chamber |
| Topic 2: |
European office relocating |
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| TECHNOLOGY REPORT NO.19 (Published on April
1, 2005) |
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| Special issue : Reliability
and Temperature Measurement Technology |
| Contents |
| Report 1 : |
Developing temperature control technology:
Utilizing a mist-cooling system for devices that generate high temperature |
| Report 2 : |
Measuring temperature, humidity,
and vibration in microenvironments |
| Report 3 : |
Evaluating joint reliability of Sn-Zn low-temperature,
lead-free solder |
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| TECHNOLOGY REPORT NO.18 (Published on October
1, 2004) |
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Special issue : Reliability testing and Maintainablity
| Contents |
| Report : |
Evaluating the bonding and insulation
characteristics of conductive adhesives |
| Understanding the Technology
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Maintainability for environmental testing
equipment |
| Topics : |
Introducing our new
Super Thermal Plate |
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| TECHNOLOGY REPORT NO.17 (Published on April 1,2004) |
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Special issue : Reliability testing and Environmental Preservation
| Contents |
| Report 1: |
Destruction mechanisms resulting from vibration load in PCB-mounted
electronics |
| Report 2: |
Promoting the commercial adoption of lead-free
solder and evaluating its reliability |
| Report 3: |
Environmental improvement operations with Furusato no Mori
(local forests) |
| Topics 1: |
Espec has landed in Europe |
| Topics 2: |
Espec Evaluation & Test Systems, Inc.established in the U.S. |
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| TECHNOLOGY REPORT NO.16
(Published on October 1,2003) |
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Special issue : Reliability testing
Contents
| Report : |
Using the EIS method
to analyze the reaction mechanisms of
the ionic migration process in solder
materials |
| Understanding
the Technology 1: |
Reliability
assurance and reliability testing (environmental
testing)
- Why defects and failure occur, and
the significance of environmental testing-
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| Understanding
the Technology 2: |
Direct-cooling recovery
equipment developed for low-boiling-point
refrigerants |
| Understanding
the Technology 3: |
Failure Analysis Methods
Part 3: Failure analysis using the scanning
electron microscope |
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| TECHNOLOGY REPORT NO.14
(Published on October 1,2002) |
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Special issue : Reliability Testing and Measurement & Evaluation
System
Contents
Report : Factors
leading to ionic migration in lead-free
solder
| Understanding
the Technology 1: |
Magnetic
characteristics evaluation system for
GMR heads |
| Understanding
the Technology 2: |
Failure
Analysis Methods
-Part
1: Cross-sectional observation of
electronic parts- |
| Topics
1: |
Network
applications for environmental testing equipment
(Part 2) -The ERC Series: Web
application software- |
| Topics
2: |
Introducing
the Espec high-frequency
electromigration evaluation systems |
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| TECHNOLOGY
REPORT NO.13 (Published
on March 15,2002) |
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Special issue: Reliability Testing and Burn-in
Systems
Contents
| Understanding
the Technology 1: |
The
current status of lead-free soldering. |
| Understanding
the Technology 2: |
Latest
trends in wafer level burn-in systems. |
| Understanding
the Technology 3: |
The
ideal state of reliability control within
corporations |
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-Response to ISO 9000S:2000 and uncertainty- |
| Topics
1: |
ESPEC FOREST
PROJECT-My Dear Hometown-
(tree-planting festival at Kobe Technocomplex
(KTC))report |
| Topics
2: |
Introducing
thermal shock chamber TSE-11-A. |
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| TECHNOLOGY
REPORT NO.12 (Published on October 1,2001)
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Special issue: Reliability Testing and Environmental
Testing Standards
Contents
Understanding the Technology: Fundamentals
of Environmental Testing Standards
Report 1: How impurities affect ionic migration,
and how to counter their impact
Report 2: Evaluating ionic migration in lead-free
solder using the Quartz Crystal Microbalance
Method
Report 3: Evaluating lead-free plating using
gas corrosion tests
Topics: Reliability Testing of passive fiber
optic components |
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| TECHNOLOGY REPORT NO.11
(Published on April 1,2001) |
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Special issue: Evaluating Reliability and
Environmental Testing
Contents
Understanding the Technology: Easy-to-read
"Features of Environmental Testing" (Part2)
Report 1: Evaluation results on reliability
of lead-free solder
-TABAI ESPEC efforts to
develop viable lead-free solder-
Report 2: The occurrence of tracking in Printed
Circuit Boards using organic insulating materials
Topics 1: Network applications for environmental
testing equipment
Topics 2: Strategies for environmental protection |
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| TECHNOLOGY REPORT NO.10
(Published on Oct.1, 2000) |
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Special issue: Safety Analysis and Testing
Standards
Contents
Understanding the Technology 1 :
Safety analysis methods and applications at
the design stage of new
product development -Introducing the FMFEA
and S-H Matrix Method-
Understanding the Technology 2 :
Easy-to-read"Features of environmental
testing"(Part1)
Understanding the Technology 3 :
Trends in IEC environmental testing standards
for LCD
Topics: Ozone protection measures for Tabai
products |
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| TECHNOLOGY REPORT NO.9
(Published on April 1, 2000) |
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Special issue: Evaluating Reliability and
Non-destructive testing
Contents
Understanding the Technology 1 : Non-destructive
testing for product and facility safety
Understanding the Technology 2 : Environmental
tesing and non-destructive failure analysis
technology
Report 1: The affects of adsorbed water on
printed circuit boards, and the process of
ionic migration
Report 2: Psychrometer construction for performance
testing in temperature and humidity chambers,
and the precision of humidity measurements
-Meeting the challenge of quality engineering-
Topics 1: Applications of the Fast Cycle Chamber |
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| TECHNOLOGY REPORT NO.8
(Published on Sep. 30, 1999) |
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Special issue: Evaluating Reliability and
Measurement System
Contents
Understanding the Technology :
Guidance for accelerated testing and reliability
-For electrical and electronic parts and equipment
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Report 1: Evaluation validity in systems with
continuous, automatic measurement
Report 2: Investigating the effects of packaging
materials on products
Topics 1: Applications of the Thermorecorder
Series
Topics 2: Tabai Espec Product preparedness
for the year-2000 problem |
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| TECHNOLOGY REPORT NO.7
(Published on Mar.31, 1999) |
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Special issue: Evaluating Reliability and
Humidity Measurement
Contents
Understanding the Technology :
Fundamental Concepts of Environmental Testing
Techniques in Electricity and Electronics
Part 4: To carry out effective environmental
testing
Report 1: An analysis of solder cracking mechanisms
Report 2: Humidity measurement and psychrometers
in environmental testing equipment
Topics: Coping with environmental preservation
in the Platinous K series |
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| TECHNOLOGY REPORT NO.6
(Published on Sep. 30, 1998) |
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Special issue: Evaluating Reliability and
Burn-in
Contents
Understanding the Technology: Fundamental
Concepts of Environmental Testing Techniques
in Electricity and Electronics Part 3: Testing standards
Report 1: Combined environmental testing for
equipment used on automobiles Overview and
test approach
Report 2: Wafer Burn-in System
Topics: Introducing the automatic clean oven
for LCD production |
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| TECHNOLOGY REPORT NO.5
(Published on Mar. 20, 1998) |
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Special issue : Evaluating Reliability
Contents
Understanding
the Technology :
Fundamental Concepts of Environmental Testing
Techniques in Electricity and Electronics
Part 2: Fundamental concepts of the standard
condition and movement of water of moisture
for performing temperature and humidity tests
Report 1:Humidity Measurement and Control
in the HAST
Report 2:Reliability of wood materials in
environmental testing
Topics:Introducing measurement evaluation
systems |
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| TECHNOLOGY REPORT NO.4
(Published on Oct. 1, 1997) |
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Special issue : Evaluating
Reliability
CONTENTS: 50 years of progress at TABAI ESPEC
Our 50th anniversary
Understanding the Technology......Fundamental
Concepts of Environmental Testing Technique
in Electricity and Electronics
Part 1: Fundamental concepts of physics and
chemistry regarding heat and humidity
Report 1: Evaluation Method for Ion Migration
Using Dew Cycle Test (Part3)
Report 2: Great Expectations for the Combined
Environmental Reliability Test (CERT): For
high assembly level or finished products
Topics : Two main TABAI ESPEC plants acquire ISO 14001 certification |
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| TECHNOLOGY REPORT NO.3(Published
on Apr. 1, 1997) |
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Special issue : Evaluating
Reliability
CONTENTS: Understanding the Technology........What
is Environmental Testing? Part 3
Report 1:Confirming Reliability of Printed
Circuit Boards with Temperature Cycle and
Thermal Shock
Report 2: The Mechanism of Solder Cracking
Topics : Traceability Service |
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| TECHNOLOGY REPORT NO.2
(Published on Nov. 1, 1996) |
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Special issue : Evaluating
Reliability
CONTENTS: Understanding the Technology........What
is Environmental Testing? Part 2
Report 1: A Consideration of Methods for Evaluating
Reliability of Electric Parts
Report 2: Explanation of International Standard
IEC 68-2-66
Topics : Agribusiness |
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| TECHNOLOGY REPORT NO.1
(Published on Apr. 1, 1996) |
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Special issue : Evaluating
Reliability
CONTENTS: On our first issue (Greeting from
the President)
Understanding the Technology........What is
Environmental Testing ?
Report 1: Evaluation Method for Ion Migration
Using Dew Cycle Test (Part 1)
Report 2: Evaluation Method for Ion Migration
Using Dew Cycle Test (Part 2)
Topics : Introducing the Artificial Climatic-simulator |
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