 |
 |
| Report 1 |
 Abstract
To date, the effect of ramp rate on solder joints during solder joint testing has not been thoroughly researched. This report is a follow-up to our article in Espec Technology Report No.25 (September 15, 2007) titled, "The effect of ramp rate on temperature cycle fatigue in solder joints." For our current report, we have tested ramp rates from market environment conditions at 15oC/min (IEC standard 60749-25) up to the liquid bath thermal shock range, and we have investigated the correlation between ramp rates and the effect on solder joints. |
|
|
| Report 2 |
Abstract
Espec Technology Report No.19 presented a report on various types of stress induced by the environment in which equipment is installed. For that report, investigators looked at special environments, such as a transportation environment in which they measured vibration, as well as temperature and humidity fluctuation. For this current report, we have measured the relationship between temperature fluctuation and convection airflow. We used thermal imaging to investigate problems of joint reliability in electronic equipment, with a special focus on the affect of heat generated by electronic devices and the cyclical cooling that occurs. We also investigated humidity fluctuation leading to dew condensation and mold in buildings, and we measured the relationship between humidity and convection airflow. Our results indicate that temperature and humidity fluctuation is strongly affected by convection airflow. |
|
|
|
|
To read Technology Report···
| We offer all of the articles for No. 27 in a PDF format. |
 Download |
| Please download each article on the above. |
|
To print articles, click  on
the bottom of each page. |
|
| You can print tables and figures at a high resolution
(Internet Explorer 5 or later comes highly recommended.). |
 |
|
Our Technology Reports are readable with an Adobe Reader plug-in.
With free Adobe
Reader software, you can view and print Adobe PDF files across a broad
range of hardware and operating systems. |
|
|
|
|
