| Our main conclusions concerning measuring temperature on PCBs and measuring the fluctuation of temperature and humidity inside buildings are as follows. |
| (1) |
When measuring the temperature on PCBs for this report, we found that for PCBs mounted with heat-generating devices, when the electrical current was on there was an uneven temperature environment with a temperature differential of more than 18oC between parts. |
| (2) |
Cycling between natural air cooling and forced air cooling was thought to generate repetitive stress, and we believe that test methods should be employed modeling this type of actual usage environment. |
| (3) |
The direction of convection airflow and wind velocity subtly change the generation and evaporation of dew condensation, and so onsite investigations and the collection of field data are effective measures to take. |
| As can be seen in the examples above, the actual usage environment may be completely different from the environments encountered in conventional tests. We believe that it is necessary to set up a system making it possible to grasp the market environment in a timely manner and to have equipment capable of simulating that environment. |
| 1) |
Zoran Radivojevic, Yasir Abdul-Quadir, Pirkka Myllykoshi, Jukka Rantana, "Reliability Prediction for TFBGA Assemblies", IEEE Transaction on Components and Packaging Technologies, Vol. 29, No. 2, pp. 379-384, 2006 |
| 2) |
Nozomi Ihara, Takeshi Yoshimura, Misa Katsuyama, "Mold Protection Performance Evaluation Method for Bathroom Mold Suppression System", MEW technical report, Vol. 52, No. 2, pp. 37 to 40, May, 2004 |
| 3) |
Koji Kaminaka, "Benefit and Risk of Automatic revolving doors (<Special Survey> Safety and Reliability of Equipments installed in Building), The journal of Reliability Engineering Association of Japan, Vol. 28, No. 6, pp. 418-425, October, 2006 |
