Simultaneous burn-in for 256 dies Use of independent drivers for each die, simultaneous current monitoring for 256 dies, and signal cut-off for each die in which a fault is detected (independent power supply and ground for each die).

Burn-in with high accuracy and reliability The contact-touch function evaluates the accuracy of burn-in to prevent errors, and the output voltage from each die is monitored for higher burn-in reliability.

Designed for a wide range of products from DRAMs to flash memory and system LSIs. ESPEC CORP supplies three burn-in systems, for DRAMs, flash memory, and system LSIs.