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The Printed Wiring Board Conductor Resistance Evaluation System, Solder Joint Evaluation System enables continuous measurement of resistance changes under high and low temperature Cycle. Automatic measurement, data storage and processing are operated systematically with a PC. Graphic display of data, compatibility with spreadsheet software, dataprocessing via LAN, are some of the features for realizing accurate and effective contact reliability evaluation.
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High precision measurement
Resistance changes in solder joints and connector joints can be measured continuously under a low/high temperature cycle environment.
Wide measurement range of
10-3 to 106Ω;
With a 4-terminal measurement method, minute resistance changes are accurately measured at the end of the cable.
Global environmental awareness
Components are mounted by lead-free soldering. In addition, power consumption is reduced by 28%* (in comparison with the previous model) in consideration of global environmental problems. *except for purchased items such as PCs and measuring instruments.
- Applications
- PB-free solder connectivity evaluation
- BGA and CSP solder ball connectivity evaluation
- Connectivity evaluation of electrically conductive adhesive and anisotropic conductive film
- Contact resistance evaluation of connector
- Contact resistance evaluation of switch and relay
- Chip capacitor connectivity evaluation
- Connectivity evaluation of dissimilar metal
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