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Electromigration testing at 1μA, 400°C
Increasing use is being made of microfabrication and new materials in order to increase the levels of performance and integration achieved with semiconductor devices. And as the operating life of devices depends on microfabrication and such new materials, it has become increasingly important to evaluate electromigration under high-precision life-acceleration conditions.High-precision control is used for the temperature (max. 400°C) and current stress that form the main factors in this life acceleration. A Black's model equation and analytical software have been provided to determine product life.