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Information TechnologyPCB
 

Current status of the market

Due to widespread of notebook PC and mobile phones, PCB is now more compact, flexible and high densitiy (multi-layer). Since the new models are sold very quickly, the development period should be shortened.

ESPEC's solution

ESPEC provides products for temperature and humidity evaluation by temperature and humidity chamber and measurement system for ion migration and conductor resistance evaluations.

Application and ESPEC products

Application Usage ESPEC Products
Production Hard drying of insulating layer coating
Interlayer connection hardening
Deforming
Dry, Save, Aging, Anneal
Evaluation Accerelated thermal cycle test
Accerelated temperature and humidity
/ bias pressure test
Acceralated high temperature test
Insulation resistance evaluation
Conductor resistance evaluation

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