Current status of the marketThe high-mix low volume production is increasing due to increase of production of system LSI. The production and evaluation within a short period of time is necessary to start up production system vertically and evaluate the endurance for increase of flash memories. ESPEC's solutionESPEC provides equipment for wafer level inspection, inspection after packaging and dry processing. There are also thermal shock chmabers and measurement system for connectivity evaluation, and compact type products responding to type and quantity changes. |
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Application and ESPEC products |
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