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  • Overview of Equipment
  • Features

TSA series (damper type, two/three zones)

Remote monitor and control
No software required.
The chamber with Ethernet port can be connected to any PCs/smartphones/tablets via a web browser.
You can monitor, control the operation, and edit test profile remotely.
Check the equipment on the monitor screen
You can check the pressure of the refrigeration system and the temperature of the cooling water on the screen or PC connected to the network. It makes operator to check refrigerator status easier.
1000 cycles continuous operation
Defrost-free operation is provided as an option so 500-hour continuous operation can be performed without interruption (if test conditions are set for 15-minute exposure).
Highly accurate temperature recovery
Specimen temperature control
A single temperature sensor is attached to the specimen in the test area and the chamber is controlled by this temperature measurement.
Specimen temperature monitor with trigger function
Two temperature sensors are attached to the specimen in the test area to measure the specimen's temperature.
The newly developed refrigeration system
To reduce thermal stress on the refrigerators and prevent corrosion in the circuit, the material and thickness of piping has been changed and this prevents refrigerant leaks.
Enhanced test halt preset function
It is now possible to program tests to halt after cycle or exposure completion. Six cycle counters are also built-in to the instrumentation so a test halt preset can be programmed for each counter.
Automatic setting of pre-cooling and pre-heating in energy saving, Eco operation mode (Patent pending)
The new series incorporates an algorithm that calculates the minimum operation time for pre-cooling and pre-heating by constantly measuring the amount of heat required for these processes in eco operation mode. This feature can further reduce power consumption and remove the inaccuracies and hassles caused by adjustments based on preliminary experiments.
Parallel refrigerator control system for energy-saving control (Patent pending)
The chamber can operate at the optimal refrigeration capacity based on the controlled temperature, by switching operation between two refrigerators simultaneously or a single refrigerator. At stable low-temperature exposures, power consumption is also reduced by limiting refrigeration capacity with an electronic expansion valve.
Photo: Remote monitoring and control
Photo: Check the equipment on the monitor screen
1000cycles (500-hour) test time comparison example
Figure: 1000cycles(500-hour) test time comparison example
Photo: Product temperature control (example)
Power consumption amount comparison example
Figure: Power consumption amount comparison example

TSE-12 (elevator type, two zones)

Test Standard Conformance

  • Meets strict Mil-Std 883 1010.8 thermal cycling requirements with 4 kg.
  • Also conformed to IEC 60068-2-14, IEC61747-5 Na.

User-friendly Touch Panel Operation

  • Operation control is done via touch panel. Very easy to use, yet full-featured.

Simple Utility

  • The only required utility is power supply.
  • The cold zone is cooled by refrigeration. No need for tanks of liquid nitrogen (or cooling water supply).

Quiet Operation

  • Super quiet operation emitting noise of less than 60dB.

TSD-101 (elevator type, two zones)

Remote monitor and control
No software required.
The chamber with Ethernet port can be connected to any PCs/smartphones/tablets via a web browser.
You can monitor, control the operation, and edit test profile remotely.
Short temperature recovery time
The two temperature zone system achieves quick specimen temperature recovery time (less than 15 min. for 10kg of ICs, at extreme temperature exposure).
Excellent temperature uniformity
Uniform airflow in test area allows outstanding temperature distribution.
It applies uniform thermal stress to specimen and contributes accurate test results.
Specimen Temperature Trigger (STT)
TSD-100 features a STT function, monitoring the specimen to launch the exposure time or going on to following step during test. Overall test duration is reduced by eliminating pretest procedures and temperature is attained with even more accuracy.
Ambient temperature recovery feature
Outside air is introduced into the test area after test is complete, to quickly restore an ambient temperature and remove specimens safely.
Viewing window (option)
Optional viewing window with interior lightning allows to check specimen and wiring during testing.
Easy wiring access
A cable port on right side allows easy wiring in specimen measurement during high and low temperature cycle test.

Specimen temperature recovery (example)
(based on MIL-883 condition C)

Test conditions

High temp. exposure: +155°C for 30 min.
Low temp. exposure: -68°C for 30 min.
Specimens: ICs, 10 kg

Temperature uniformity measurement method

Thermocouples were embedded in 10 ICs placed on two levels in each of the corners and in the center of a specimen basket. (Specimens with embedded thermocouples were placed beneath other ICs.)

Graph: Specimen temperature recovery (example)

Temperature uniformity performance (example)

Test conditions

High temp. exposure: +150°C for 30 min.
Low temp. exposure: -65°C for 30 min.
Specimens: ICs (×10)

Temperature uniformity measurement method

Thermocouples were attached to the surface of 10 ICs placed on two levels in each of the corners and in the center of a specimen basket.

Graph: Temperature uniformity performance (example)

Test time comparison (example)

Test conditions

High temp. exposure: +150°C, 15 min. after recovery
Low temp. exposure: -65°C, 15 min. after recovery
Specimens: ICs, 10kg
Control points: Upstream of sensor positions

Measurements

Test time reductions of approximately 15 minutes per cycle compared to other ESPEC models. For 3,000 cycles testing this cuts previous test times from 4.5 months to approximately 1 month.

Compatible test standards

IEC 60749-25 : Semiconductor devices – Temperature cycling

IEC 60068-2-14 Na : Environmental testing – Change of temperature

IEC 61747-5 Na : Liquid crystal and solid-state display devices – Environmental, endurance and mechanical test methods

MIL-STD-883 : Military standard, microcircuits, test standards

IPC-TM-650 2.6.6 : Temperature cycling, printed wiring board

SAE J1879 : Handbook for robustness validation of semiconductor devices in automotive applications

JASO-D902 : Durability testing methods for automotive electronic equipment

EIAJ ED-4701 : Environmental and endurance test methods for semiconductor devices. (General)

EIAJ ED-4702 : Mechanical stress test methods for semiconductor surface mounting devices

EIAJ ED-7407 : Environmental and endurance test methods for CSP, BGA package on mounting condition